Invention Grant
US08031421B2 Method for measuring optimum seeking time and inspection apparatus using the same
有权
测量最佳寻道时间的方法及使用该方法的检查装置
- Patent Title: Method for measuring optimum seeking time and inspection apparatus using the same
- Patent Title (中): 测量最佳寻道时间的方法及使用该方法的检查装置
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Application No.: US12788481Application Date: 2010-05-27
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Publication No.: US08031421B2Publication Date: 2011-10-04
- Inventor: Kenichi Shitara , Sumihiro Maeda
- Applicant: Kenichi Shitara , Sumihiro Maeda
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Brundidge & Stanger, P.C.
- Priority: JP2009-128633 20090528
- Main IPC: G11B27/36
- IPC: G11B27/36

Abstract:
The present invention provides a method for measuring an optimum seeking time and an inspection apparatus using this method capable of measuring and setting an optimum seeking time for inspection of a magnetic disk or magnetic head. The method samples average level differences of sector-wise read signals in positive and negative domains for one round of track and detects a minimum value H and a minimum value L among these differences. The method recalculates the seeking time while changing the settling time. After writing and reading test data, calculates a deviation DEV of average levels DEV=(H−L)/(H+L). The method is adapted to obtain a minimum one of the values of settling time having measured when the deviation DEV of average levels is equal to or less than a predetermined value as an optimum settling time or an optimum seeking time.
Public/Granted literature
- US20100302665A1 METHOD FOR MEASURING OPTIMUM SEEKING TIME AND INSPECTION APPARATUS USING THE SAME Public/Granted day:2010-12-02
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