Invention Grant
- Patent Title: Structure for mounting feedthrough capacitors
- Patent Title (中): 用于安装馈通电容器的结构
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Application No.: US12259777Application Date: 2008-10-28
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Publication No.: US08031480B2Publication Date: 2011-10-04
- Inventor: Masaaki Togashi
- Applicant: Masaaki Togashi
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-317542 20071207
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial region of the first feedthrough capacitor flows in a direction opposite to that in the partial region of the second feedthrough capacitor.
Public/Granted literature
- US20090147489A1 STRUCTURE FOR MOUNTING FEEDTHROUGH CAPACITORS Public/Granted day:2009-06-11
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