Invention Grant
- Patent Title: IC packages with internal heat dissipation structures
- Patent Title (中): 具有内部散热结构的IC封装
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Application No.: US11454356Application Date: 2006-06-16
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Publication No.: US08031484B2Publication Date: 2011-10-04
- Inventor: Huili Fu , Man Lung Sham , Chang-Hwa Chung
- Applicant: Huili Fu , Man Lung Sham , Chang-Hwa Chung
- Applicant Address: CN Hong Kong
- Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Co., Ltd.
- Current Assignee Address: CN Hong Kong
- Agency: Fulbright & Jaworski L.L.P.
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04
Abstract:
An IC package includes a substrate and a plurality of thermal dissipating vias perforating the substrate. The substrate includes a power plane, a ground plane, and a dielectric layer disposed between the power plane and the ground plane. The power plane includes a power region and a non-power region isolated from each other. The thermal dissipating vias are connected to the non-power regions of the power plane and to the ground plane.
Public/Granted literature
- US20070291457A1 IC packages with internal heat dissipation structures Public/Granted day:2007-12-20
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