Invention Grant
US08031754B2 Surface emitting laser element, surface emitting laser element array, method of fabricating a surface emitting laser element
有权
表面发射激光元件,表面发射激光元件阵列,制造表面发射激光元件的方法
- Patent Title: Surface emitting laser element, surface emitting laser element array, method of fabricating a surface emitting laser element
- Patent Title (中): 表面发射激光元件,表面发射激光元件阵列,制造表面发射激光元件的方法
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Application No.: US12108931Application Date: 2008-04-24
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Publication No.: US08031754B2Publication Date: 2011-10-04
- Inventor: Norihiro Iwai , Takeo Kageyama , Kinuka Tanabe
- Applicant: Norihiro Iwai , Takeo Kageyama , Kinuka Tanabe
- Applicant Address: JP Tokyo
- Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee: The Furukawa Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: H01S5/00
- IPC: H01S5/00

Abstract:
A surface emitting laser element that includes a cylindrical mesa post in which a plurality of semiconductor layers including an active layer is grown and that emits a laser light in a direction perpendicular to a substrate surface, the surface emitting laser element including a dielectric multilayer film on a top surface of the mesa post in at least a portion over a current injection area of the active layer; and a dielectric portion that includes layers fewer than layers of the dielectric multilayer film and that is arranged on a portion excluding the portion over the current injection area on the top surface of the mesa post and on at least part of a side surface of the mesa post.
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