Invention Grant
- Patent Title: Integrated circuit/printed circuit board substrate structure and communications
- Patent Title (中): 集成电路/印刷电路板基板结构和通信
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Application No.: US11648756Application Date: 2006-12-30
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Publication No.: US08032089B2Publication Date: 2011-10-04
- Inventor: Ahmadreza (Reza) Rofougaran
- Applicant: Ahmadreza (Reza) Rofougaran
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Garlick Harrison & Markison
- Agent Jessica W. Smith
- Main IPC: H04B1/38
- IPC: H04B1/38

Abstract:
A radio transceiver device includes circuitry for radiating electromagnetic signals at a very high radio frequency both through space, as well as through wave guides that are formed within a substrate material. In one embodiment, the substrate comprises a dielectric substrate formed within a board, for example, a printed circuit board. In another embodiment of the invention, the wave guide is formed within a die of an integrated circuit radio transceiver. A plurality of transceivers with different functionality is defined. Substrate transceivers are operable to transmit through the wave guides, while local transceivers are operable to produce very short range wireless transmissions through space. A third and final transceiver is a typical wireless transceiver for communication with remote (non-local to the device) transceivers.
Public/Granted literature
- US20080160931A1 Integrated circuit/printed circuit board substrate structure and communications Public/Granted day:2008-07-03
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