Invention Grant
US08032851B2 Structure for an integrated circuit design for reducing coupling between wires of an electronic circuit
有权
用于减少电子线路的线之间的耦合的集成电路设计的结构
- Patent Title: Structure for an integrated circuit design for reducing coupling between wires of an electronic circuit
- Patent Title (中): 用于减少电子线路的线之间的耦合的集成电路设计的结构
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Application No.: US11845852Application Date: 2007-08-28
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Publication No.: US08032851B2Publication Date: 2011-10-04
- Inventor: Moussadek Belaidi , Markus Buehler , James J. Curtin , Adam P. Matheny , Bryan A. Meyer , Douglas S. Search , Dhaval R. Sejpal , Charles Vakirtzis
- Applicant: Moussadek Belaidi , Markus Buehler , James J. Curtin , Adam P. Matheny , Bryan A. Meyer , Douglas S. Search , Dhaval R. Sejpal , Charles Vakirtzis
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Gibb I.P. Law Firm, LLC
- Agent David Cain, Esq.
- Priority: EP06124167 20061115
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A design structure for reducing coupling between wires of an electronic circuit is proposed, wherein sets of nets are classified according to their coupling characteristics, and spacing between wires assigned to the sets of nets is chosen according to the coupling characteristics.
Public/Granted literature
- US20080184186A1 INTEGRATED CIRCUIT DESIGN FOR REDUCING COUPLING BETWEEN WIRES OF AN ELECTRONIC CIRCUIT Public/Granted day:2008-07-31
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