Invention Grant
- Patent Title: Adhesive composition and adhesive sheet
- Patent Title (中): 粘合剂组合物和粘合片
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Application No.: US11794541Application Date: 2005-09-12
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Publication No.: US08034849B2Publication Date: 2011-10-11
- Inventor: Masao Murakami , Hirofumi Hashimoto , Noboru Araki
- Applicant: Masao Murakami , Hirofumi Hashimoto , Noboru Araki
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee: Sony Corporation,Sony Chemical & Information Device Corporation
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2005-027905 20050203
- International Application: PCT/JP2005/016720 WO 20050912
- International Announcement: WO2006/082672 WO 20060810
- Main IPC: C08F2/50
- IPC: C08F2/50 ; C08J3/28 ; B32B17/12 ; B32B15/04

Abstract:
A pressure-sensitive adhesive composition capable of giving a pressure-sensitive adhesive sheet which simultaneously realizes satisfactory holding power, adhesion, and peel resistance in peeling from curved surfaces, while balancing these properties, and has satisfactory heat resistance. The composition comprises the following ingredients: (A) a maleimide crosslinking agent having two or more maleimide groups per molecule; (B) a monomer which, when caused to homopolymerize, gives a homopolymer having a glass transition temperature of −40° C. or lower; (C) a carboxylated monomer copolymerizable with the monomer of the ingredient (B); and (D) a photopolymerization initiator, the maleimide crosslinking agent of the ingredient (A) being contained in an amount of 0.01-2 parts by weight per 100 parts by weight of the sum of the monomers of the ingredients (B) and (C).
Public/Granted literature
- US20080299388A1 Adhesive Composition and Adhesive Sheet Public/Granted day:2008-12-04
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