Invention Grant
- Patent Title: Bonded wafer SAW filters and methods
- Patent Title (中): 粘结晶片SAW滤波器和方法
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Application No.: US12398711Application Date: 2009-03-05
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Publication No.: US08035464B1Publication Date: 2011-10-11
- Inventor: Benjamin P. Abbott , Robert Aigner , Julien Gratier , Taeho Kook
- Applicant: Benjamin P. Abbott , Robert Aigner , Julien Gratier , Taeho Kook
- Applicant Address: US FL Orlando
- Assignee: Triquint Semiconductor, Inc.
- Current Assignee: Triquint Semiconductor, Inc.
- Current Assignee Address: US FL Orlando
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: H03H9/64
- IPC: H03H9/64

Abstract:
Improved coupling coefficients and desirable filter characteristics are exhibited in a SAW filter including an electrode pattern deposited on a piezoelectric substrate bonded directly to an anti-reflective layer, wherein the anti-reflective layer is bonded to a carrier through an adhesive layer such that a preselected thickness of the anti-reflective layer is sufficient for enhancing an acoustic match between the piezoelectric substrate and the adhesive layer.
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