Invention Grant
US08035464B1 Bonded wafer SAW filters and methods 有权
粘结晶片SAW滤波器和方法

Bonded wafer SAW filters and methods
Abstract:
Improved coupling coefficients and desirable filter characteristics are exhibited in a SAW filter including an electrode pattern deposited on a piezoelectric substrate bonded directly to an anti-reflective layer, wherein the anti-reflective layer is bonded to a carrier through an adhesive layer such that a preselected thickness of the anti-reflective layer is sufficient for enhancing an acoustic match between the piezoelectric substrate and the adhesive layer.
Information query
Patent Agency Ranking
0/0