An integrated circuit device includes a scan driver block, a high-speed interface circuit block, and a scan driver pad arrangement region in which pads electrically connecting scan output lines of the scan driver block and scan lines are disposed. The high-speed interface circuit block includes a physical layer circuit that receives data using differential signals, and a link controller that performs a link layer process. The scan output lines of the scan driver block are provided from the scan driver block to the scan driver pad arrangement region to pass over the link controller while avoiding the physical layer circuit. A common voltage line connecting first and second common voltage pads is provided from the first common voltage pad to the second common voltage pad along a first direction, the common voltage line being provided in a second direction with respect to the physical layer circuit along the first direction in an arrangement region of the physical layer circuit.