Invention Grant
- Patent Title: Surface plasmon resonance sensor chip
- Patent Title (中): 表面等离子体共振传感器芯片
-
Application No.: US12365307Application Date: 2009-02-04
-
Publication No.: US08035810B2Publication Date: 2011-10-11
- Inventor: Atsushi Tazuke , Daisuke Niwa , Yoshikatsu Miura , Dai Ohnishi
- Applicant: Atsushi Tazuke , Daisuke Niwa , Yoshikatsu Miura , Dai Ohnishi
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2008-025141(P) 20080205
- Main IPC: G01N21/01
- IPC: G01N21/01

Abstract:
A surface plasmon resonance sensor chip includes: a first dielectric layer; a metal layer disposed on the first dielectric layer; and a second dielectric layer covering the metal layer, the chip being provided with an opening that makes a part of a surface on the side of the second dielectric layer of the metal layer be exposed, and allows a measurement sample and the surface on the side of the second dielectric layer to contact each other, wherein an organic molecule film is provided at least one of between the first dielectric layer and the metal layer, and between the metal layer and the second dielectric layer.
Public/Granted literature
- US20090195783A1 SURFACE PLASMON RESONANCE SENSOR CHIP Public/Granted day:2009-08-06
Information query