Invention Grant
- Patent Title: Surface-mount type electrolytic capacitor and method of producing the same
- Patent Title (中): 表面贴装型电解电容器及其制造方法
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Application No.: US11998285Application Date: 2007-11-29
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Publication No.: US08035954B2Publication Date: 2011-10-11
- Inventor: Osamu Funaya
- Applicant: Osamu Funaya
- Applicant Address: JP Sendai-Shi
- Assignee: NEC Tokin Corporation
- Current Assignee: NEC Tokin Corporation
- Current Assignee Address: JP Sendai-Shi
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2006-321853 20061129; JP2007-208070 20070809
- Main IPC: H01G9/10
- IPC: H01G9/10 ; H01G2/10 ; H01G9/08 ; B65D51/00 ; H05K5/03

Abstract:
An exterior case for a surface-mount type electrolytic capacitor has a box type resin case and an exterior case cover. The resin case incorporates anode terminals and a cathode terminal at the bottom portion and is open upward. The exterior cover covers the top and an outer surface of a side wall of the resin case. A convex portion is formed on an inner surface of a ceiling of the exterior case cover and, thereby, a concave portion is formed between an inner surface of the side wall of the exterior case cover and the convex portion. The concave portion and an upper end portion of the side wall of the resin case are fitted together with an adhesive therebetween. An upper surface of the capacitor element is pressed by the convex portion of the inner surface of the ceiling of the exterior case cover and, thereby, a positional deviation thereof is prevented.
Public/Granted literature
- US20080123253A1 Surface-mount type electrolytic capacitor and method of producing the same Public/Granted day:2008-05-29
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