Invention Grant
US08035992B2 Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip 有权
垂直转换,印刷电路板和半导体封装与印刷电路板和半导体芯片

  • Patent Title: Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip
  • Patent Title (中): 垂直转换,印刷电路板和半导体封装与印刷电路板和半导体芯片
  • Application No.: US12089483
    Application Date: 2006-10-10
  • Publication No.: US08035992B2
    Publication Date: 2011-10-11
  • Inventor: Taras KushtaKaoru Narita
  • Applicant: Taras KushtaKaoru Narita
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2005-302977 20051018
  • International Application: PCT/JP2006/320219 WO 20061010
  • International Announcement: WO2007/046271 WO 20070426
  • Main IPC: H05K9/00
  • IPC: H05K9/00
Vertical transitions, printed circuit boards therewith and semiconductor packages with the printed circuit boards and semiconductor chip
Abstract:
Provided are vertical transitions which have the high electrical performance and the high shielding properties in the wide frequency band in a multilayer PCB, printed circuit boards with the vertical transitions and semiconductor packages with the printed circuit boards and semiconductor chips. In vertical transitions for a multilayer PCB, a wave guiding channel is a conductor which includes at least more than one of signal vias 201, an assembly of ground vias 202 surrounding the signal via, ground plates from conductor layers of the PCB connected to the ground vias, closed ground striplines 205 connecting the ground vias and power supply layer.
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