Invention Grant
- Patent Title: High frequency storing case and high frequency module
- Patent Title (中): 高频存储箱和高频模块
-
Application No.: US12918239Application Date: 2009-02-26
-
Publication No.: US08035994B2Publication Date: 2011-10-11
- Inventor: Takuya Suzuki
- Applicant: Takuya Suzuki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2008-124919 20080512
- International Application: PCT/JP2009/053593 WO 20090226
- International Announcement: WO2009/139210 WO 20091119
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
A cavity configured by electrically connecting an earth conductor formed on a multilayer dielectric substrate and on which a plurality of high frequency circuits are mounted, and a shield cover member. A waveguide aperture is formed on the earth conductor on which the high frequency circuits are mounted and is electrically coupled to the cavity, and an end-short-circuited dielectric waveguide formed in a direction of layer lamination of the multilayer dielectric substrate is connected to the waveguide aperture, and has a length approximately ¼ of an effective wavelength in the substrate of a signal wave. Spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity.
Public/Granted literature
- US20100315799A1 HIGH FREQUENCY STORING CASE AND HIGH FREQUENCY MODULE Public/Granted day:2010-12-16
Information query