Invention Grant
US08037272B2 Structure for memory chip for high capacity memory subsystem supporting multiple speed bus 有权
支持多速总线的高容量存储器子系统的存储器芯片结构

Structure for memory chip for high capacity memory subsystem supporting multiple speed bus
Abstract:
A design structure is provided for a memory module containing an interface for receiving memory access commands from an external source, in which a first portion of the interface receives memory access data at a first bus frequency and a second portion of the interface receives memory access data at a second different bus frequency. Preferably, the memory module contains a second interface for re-transmitting memory access data, also operating at dual frequency. The memory module is preferably used in a high-capacity memory subsystem organized in a tree configuration in which data accesses are interleaved. Preferably, the memory module has multiple-mode operation, one of which supports dual-speed buses for receiving and re-transmitting different parts of data access commands, and another of which supports conventional daisy-chaining.
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