Invention Grant
- Patent Title: Device mounting board and semiconductor apparatus using the same
- Patent Title (中): 装置安装板及使用其的半导体装置
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Application No.: US11143297Application Date: 2005-06-01
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Publication No.: US08039948B2Publication Date: 2011-10-18
- Inventor: Ryosuke Usui , Takeshi Nakamura
- Applicant: Ryosuke Usui , Takeshi Nakamura
- Applicant Address: JP Osaka
- Assignee: Sanyo Electric Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Fish & Richardson P.C.
- Priority: JP2004-163603 20040601
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A device mounting board for a device to be mounted on, comprising: a substrate; and a laminated film composed of a plurality of insulating layers formed on one side of the substrate. Here, any of the second and subsequent insulating layers from the substrate is a photosolder resist layer containing a cardo type polymer. The photosolder resist layer has a thickness smaller than that of the insulating resin film arranged between the photosolder resist layer and the substrate.
Public/Granted literature
- US20050280148A1 Device mounting board and semiconductor apparatus using the same Public/Granted day:2005-12-22
Information query
IPC分类:
