Invention Grant
- Patent Title: Dipole for hemispherical coverage antenna
- Patent Title (中): 偶极子用于半球覆盖天线
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Application No.: US12337579Application Date: 2008-12-17
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Publication No.: US08040288B2Publication Date: 2011-10-18
- Inventor: John E. Baldauf
- Applicant: John E. Baldauf
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group
- Main IPC: H01Q21/26
- IPC: H01Q21/26 ; H01Q21/20

Abstract:
Systems and methods for providing an antenna enabling hemispherical coverage are disclosed. The system includes a conductive enclosure having an open portion and a closed portion. The system further includes a pair of perpendicularly-disposed dipole antennas. Each antenna of the perpendicularly-disposed dipole antennas includes a pair of conductors extending to a pair of tips disposed outside of the open portion of the conductive enclosure. The system further includes a hybrid coupler having a pair of output terminals coupled to each pair of conductors of each antenna of the perpendicularly-disposed dipole antennas. The hybrid coupler is configured to apply signals of equal magnitude to the each antenna of the perpendicularly-disposed dipole antennas that differ in phase by ninety degrees.
Public/Granted literature
- US20100149062A1 DIPOLE FOR HEMISPHERICAL COVERAGE ANTENNA Public/Granted day:2010-06-17
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