Invention Grant
- Patent Title: Exposure method, substrate stage, exposure apparatus, and device manufacturing method
- Patent Title (中): 曝光方法，基材台，曝光装置和装置制造方法
-
Application No.: US12007450Application Date: 2008-01-10
-
Publication No.: US08040491B2Publication Date: 2011-10-18
- Inventor: Soichi Owa , Nobutaka Magome , Shigeru Hirukawa , Yoshihiko Kudo
- Applicant: Soichi Owa , Nobutaka Magome , Shigeru Hirukawa , Yoshihiko Kudo
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2003-169904 20030613; JP2003-383887 20031113; JP2004-039654 20040217
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/42 ; G03B27/58 ; G03B27/32
Abstract:
An exposure apparatus exposes a substrate by projecting a pattern image onto the substrate through a liquid. The exposure apparatus includes a projection optical system by which the pattern image is projected onto the substrate, and a movable member which is movable relative to the projection optical system. A liquid-repellent member, at least a part of a surface of which is liquid-repellent, is provided detachably on the movable member, the liquid-repellent member being different from the substrate.
Public/Granted literature
- US20080117394A1 Exposure method, substrate stage, exposure apparatus, and device manufacturing method Public/Granted day:2008-05-22
Information query
