Invention Grant
- Patent Title: Encapsulation of E1-type frames under ethernet
- Patent Title (中): E1以太网帧封装
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Application No.: US11453794Application Date: 2006-06-16
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Publication No.: US08040887B2Publication Date: 2011-10-18
- Inventor: Xavier Boutaud De La Combe , Pierre Dupuy , Alf Neustadt , Jean Thiberville
- Applicant: Xavier Boutaud De La Combe , Pierre Dupuy , Alf Neustadt , Jean Thiberville
- Applicant Address: FR Paris
- Assignee: Alcatel Lucent
- Current Assignee: Alcatel Lucent
- Current Assignee Address: FR Paris
- Agency: Carmen Patti Law Group, LLC
- Priority: FR0551654 20050617
- Main IPC: H04L12/56
- IPC: H04L12/56

Abstract:
An apparatus (D) is dedicated to processing E1 data frames in communications network equipment (ETPL) including at least one E1 line interface unit (LIU1). The apparatus (D) includes a processor adapted, on receiving from at least one E1 interface unit (LIU1) at least one E1-type frame addressed to a given E1 destination port, to encapsulate that E1-type frame in a payload data field of an Ethernet frame in order to send it to an Ethernet destination port providing access to the given E1 destination port.
Public/Granted literature
- US20070053364A1 Encapsulation of E1-type frames under Ethernet Public/Granted day:2007-03-08
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