Invention Grant
US08041197B2 Heating apparatus, heat treatment apparatus, computer program and storage medium
有权
加热装置，热处理装置，计算机程序和存储介质
- Patent Title: Heating apparatus, heat treatment apparatus, computer program and storage medium
- Patent Title (中): 加热装置，热处理装置，计算机程序和存储介质
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Application No.: US12120637Application Date: 2008-05-14
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Publication No.: US08041197B2Publication Date: 2011-10-18
- Inventor: Shigeru Kasai , Tomohiro Suzuki
- Applicant: Shigeru Kasai , Tomohiro Suzuki
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-329381 20051114
- Main IPC: F26B19/00
- IPC: F26B19/00
Abstract:
A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased/reduced at a high speed in uniform temperature distribution, irrespective of the film type.
Public/Granted literature
- US20080226272A1 HEATING APPARATUS, HEAT TREATMENT APPARATUS, COMPUTER PROGRAM AND STORAGE MEDIUM Public/Granted day:2008-09-18
Information query
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