Invention Grant
US08044301B2 Printed circuit board provided with heat circulating medium and method for manufacturing the same 有权
配有热循环介质的印刷电路板及其制造方法

  • Patent Title: Printed circuit board provided with heat circulating medium and method for manufacturing the same
  • Patent Title (中): 配有热循环介质的印刷电路板及其制造方法
  • Application No.: US11777029
    Application Date: 2007-07-12
  • Publication No.: US08044301B2
    Publication Date: 2011-10-25
  • Inventor: Jae Hyun Son
  • Applicant: Jae Hyun Son
  • Applicant Address: KR Kyoungki-do
  • Assignee: Hynix Semiconductor Inc.
  • Current Assignee: Hynix Semiconductor Inc.
  • Current Assignee Address: KR Kyoungki-do
  • Agency: Ladas & Parry LLP
  • Priority: KR10-2007-0047017 20070515
  • Main IPC: H05K1/03
  • IPC: H05K1/03 H05K3/02
Printed circuit board provided with heat circulating medium and method for manufacturing the same
Abstract:
A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.
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