Invention Grant
- Patent Title: Printed circuit board provided with heat circulating medium and method for manufacturing the same
- Patent Title (中): 配有热循环介质的印刷电路板及其制造方法
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Application No.: US11777029Application Date: 2007-07-12
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Publication No.: US08044301B2Publication Date: 2011-10-25
- Inventor: Jae Hyun Son
- Applicant: Jae Hyun Son
- Applicant Address: KR Kyoungki-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Kyoungki-do
- Agency: Ladas & Parry LLP
- Priority: KR10-2007-0047017 20070515
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K3/02

Abstract:
A printed circuit board includes a lower plate provided with an internal circuit wiring and having a recessed part at a surface thereof and a plurality of projection patterns at a lower surface of the recessed part; an upper plate having the same structure of the lower plate and adhered to the lower plate so that surfaces formed with the recessed part are opposite to each other; a heat circulation medium injected into an internal space formed by the recessed parts of the lower and upper plates.
Public/Granted literature
- US20080286531A1 PRINTED CIRCUIT BOARD PROVIDED WITH HEAT CIRCULATING MEDIUM AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2008-11-20
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