Invention Grant
- Patent Title: Method and apparatus for providing an additional ground pad and electrical connection for grounding a magnetic recording head
- Patent Title (中): 用于提供用于使磁记录头接地的附加接地焊盘和电连接的方法和装置
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Application No.: US12145464Application Date: 2008-06-24
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Publication No.: US08045295B2Publication Date: 2011-10-25
- Inventor: Yen Fu , Ellis T. Cha , Po-Kang Wang , Hong Tian , Manuel Hernandez , Yaw-Shing Tang , Ben Hu
- Applicant: Yen Fu , Ellis T. Cha , Po-Kang Wang , Hong Tian , Manuel Hernandez , Yaw-Shing Tang , Ben Hu
- Applicant Address: HK Shatin, N.T.
- Assignee: SAE Magnetics (HK) Ltd.
- Current Assignee: SAE Magnetics (HK) Ltd.
- Current Assignee Address: HK Shatin, N.T.
- Agency: Saile Ackerman LLC
- Agent Stephen B. Ackerman
- Main IPC: G11B5/55
- IPC: G11B5/55

Abstract:
Method and apparatus are presented for electrically coupling a slider to ground. In one embodiment, a bonding pad is provided on a side of the slider body separate from the bonding pad(s) used for read/write signals. This separate bonding pad is electrically coupled within the slider body to components that are to be coupled to ground. A separate conductor provided on the suspension (e.g., a trace, a flex circuit, etc.) may be electrically coupled to the separate bonding pad via gold ball bonding. The conductor is also coupled to ground in the hard-disk drive device (e.g., via the preamplifier). The use of the separated bonding pad and trace may negate the need to use a conductive adhesive to electrically ground the slider via its attachment to the tongue of a slider.
Public/Granted literature
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