An integrated lead flexure having a spring metal layer, a dielectric insulating layer on a side of the spring metal layer, a conductor layer on the side of the insulating layer opposite the spring metal layer and a coverlay on the side of the conductor layer opposite the insulating layer. The flexure further includes base region, a gimbal region extending from the base region, and a tail region extending from the base region opposite the gimbal region. The conductor layer includes terminal pads at the tail region and head bond pads at the gimbal region. Traces in the conductor layer extend between the terminal pads and the head bond pads across the tail, base and gimbal regions. One or more spring metal windows in the spring metal layer at the tail region are adjacent to substantial portions of at least some of the traces. One or more coverlay windows in the coverlay at the tail region are adjacent to substantial portions of the tail region spring metal windows.