A server and cooler module arrangement includes a server accommodating a stack of an operating system and an electronic device in an accommodation chamber therein at one side and an access device unit in the accommodation chamber at an opposite side, and a cooler module, which comprises a rack mounted in a partition way in the accommodation chamber between the stack of operating system and electronic device and the access device unit and a plurality of fans respectively adjustably mounted in respective open frames at different elevations and adapted for drawing air or sending air toward different heat sources in the operating system, the electronic device and the access device unit for quick dissipation of waste heat.