Invention Grant
US08045331B2 Printed circuit board, method of fabricating the same, and electronic apparatus employing the same
有权
印刷电路板，其制造方法以及采用该印刷电路板的电子设备
- Patent Title: Printed circuit board, method of fabricating the same, and electronic apparatus employing the same
- Patent Title (中): 印刷电路板，其制造方法以及采用该印刷电路板的电子设备
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Application No.: US12188319Application Date: 2008-08-08
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Publication No.: US08045331B2Publication Date: 2011-10-25
- Inventor: Ho-Seong Seo , Young-Min Lee , Kyu-Sub Kwak
- Applicant: Ho-Seong Seo , Young-Min Lee , Kyu-Sub Kwak
- Applicant Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Maetan-dong, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2007-0080098 20070809
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/02 ; H01L21/48
Abstract:
A printed circuit board includes a core layer, an insulation layer formed on the core layer and having a cavity formed on a part of the insulation layer, and a circuit pattern formed on the insulation layer, wherein the circuit pattern comprises one or more external terminals positioned above the cavity.
Public/Granted literature
- US20090040704A1 PRINTED CIRCUIT BOARD, METHOD OF FABRICATING THE SAME, AND ELECTRONIC APPARATUS EMPLOYING THE SAME Public/Granted day:2009-02-12
Information query
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