Invention Grant
- Patent Title: Multiple component mounting system
- Patent Title (中): 多部件安装系统
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Application No.: US12168885Application Date: 2008-07-07
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Publication No.: US08045339B2Publication Date: 2011-10-25
- Inventor: Darren B. Pav
- Applicant: Darren B. Pav
- Applicant Address: US TX Round Rock
- Assignee: Dell Products L.P.
- Current Assignee: Dell Products L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Haynes and Boone, LLP
- Main IPC: H05K7/02
- IPC: H05K7/02 ; H05K7/04

Abstract:
A multiple component mounting system includes a first carrier including a base. A plurality of first component coupling members are located on the base and define a first component channel. At least one of the first component coupling members include a first resilient member that is operable to engage a first component when the first component is located in the first component channel in order to secure the first component to the base free of the use of a tool. A plurality of second component coupling members are located on the base and define a second component channel. At least one of the second component coupling members include a second resilient member that is operable to engage a second component when the second component is located in the second component channel in order to secure the second component to the base free of the use of a tool. A plurality of second carrier coupling members are located on the base and operable to secure the base to a second carrier that may then be mounted to an information handling system chassis.
Public/Granted literature
- US20100002366A1 Multiple Component Mounting System Public/Granted day:2010-01-07
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