Invention Grant
- Patent Title: Method of making a connection component with posts and pads
- Patent Title (中): 使用柱和垫制作连接部件的方法
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Application No.: US12321210Application Date: 2009-01-16
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Publication No.: US08046912B2Publication Date: 2011-11-01
- Inventor: Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- Applicant: Yoichi Kubota , Teck-Gyu Kang , Jae M. Park , Belgacem Haba
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
A packaged microelectronic element includes connection component incorporating a dielectric layer (22) carrying traces (58) remote from an outer surface (26), posts (48) extending from the traces and projecting beyond the outer surface of the dielectric, and pads (30) exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts (74) exposed on the front surface of the microelectronic element are connected to the pads by elongated leads (76) such as wire bonds. Methods of making the connection component are also disclosed.
Public/Granted literature
- US20090133254A1 Components with posts and pads Public/Granted day:2009-05-28
Information query
