The present invention relates to a pressure application device for curing an adhesive on a component, particularly components of complex geometries. The device comprises a pair of jaws, at least one spring recessed into a cavity defined within the first jaw, and a cap. A first end of a spring partially extends into the cavity and a second end of the spring contacts the cap. When force is applied to the cap, the cap transmits the force through the spring to the first jaw. In order to limit the separation of the cap from the first jaw, a retainer is used.