A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.