Invention Grant
US08047273B2 Micro heat exchanger and its use as cooler for electronic components
有权
微型换热器及其作为电子部件的冷却器
- Patent Title: Micro heat exchanger and its use as cooler for electronic components
- Patent Title (中): 微型换热器及其作为电子部件的冷却器
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Application No.: US12069397Application Date: 2008-02-08
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Publication No.: US08047273B2Publication Date: 2011-11-01
- Inventor: Klaus Schubert , Jürgen Brandner , Ulrich Schygulla , Eugen Anurjew , Edgar Hansjosten
- Applicant: Klaus Schubert , Jürgen Brandner , Ulrich Schygulla , Eugen Anurjew , Edgar Hansjosten
- Applicant Address: DE Karlsruhe
- Assignee: Forschungszentrum Karlsruhe GmbH
- Current Assignee: Forschungszentrum Karlsruhe GmbH
- Current Assignee Address: DE Karlsruhe
- Agent Klaus J. Bach
- Priority: DE102005058780 20051209
- Main IPC: F28D7/00
- IPC: F28D7/00

Abstract:
In a micro heat exchanger for the transfer of high area-specific amounts of heat from a heat source to a heat transfer medium, including a heat transfer structure with an inlet- and an outlet duct structure between which a plurality of passages extend through the heat transfer structure, the inlet and outlet duct structures are arranged in alternating order in the heat transfer area in close proximity to the heat source, with the inlet and outlet duct structure and the passages interconnecting the inlet and outlet structures covering the whole heat transfer area directly adjacent the heat source.
Public/Granted literature
- US20080173435A1 Micro heat exchanger and its use as cooler for electronic components Public/Granted day:2008-07-24
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