Invention Grant
- Patent Title: Wireless IC device and method of manufacturing the same
- Patent Title (中): 无线IC器件及其制造方法
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Application No.: US12940103Application Date: 2010-11-05
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Publication No.: US08047445B2Publication Date: 2011-11-01
- Inventor: Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
- Applicant: Noboru Kato , Jun Sasaki , Satoshi Ishino , Katsumi Taniguchi
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-133829 20080522
- Main IPC: G06K19/06
- IPC: G06K19/06
Abstract:
A wireless IC device includes a plurality of insulating sheets that are stacked on top of one another. Coil electrodes are arranged so as to sandwich the insulating sheets therebetween and define an antenna coil by being connected to one another. The coil electrodes are superposed with one another and thereby define a single ring when viewed in plan from a z-axis direction.
Public/Granted literature
- US20110049249A1 WIRELESS IC DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-03-03
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