Invention Grant
- Patent Title: Fluid filled type vibration damping device
- Patent Title (中): 流体填充式减震装置
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Application No.: US12232512Application Date: 2008-09-18
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Publication No.: US08047513B2Publication Date: 2011-11-01
- Inventor: Mutsumi Muraoka , Hironori Koyama
- Applicant: Mutsumi Muraoka , Hironori Koyama
- Applicant Address: JP Komaki-shi
- Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee: Tokai Rubber Industries, Ltd.
- Current Assignee Address: JP Komaki-shi
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-246165 20070921; JP2007-337012 20071227
- Main IPC: F16M13/00
- IPC: F16M13/00

Abstract:
A vibration damping device including: a pressure-receiving chamber and an equilibrium chamber connected by a first orifice passage; a movable member disposed within the pressure-receiving chamber, to form a primary fluid chamber partly defined by a rubber elastic body, and an auxiliary fluid chamber partly defined by an oscillating plate; and a second orifice passage connecting the auxiliary fluid chamber to the equilibrium chamber. A through-hole is formed in a partition member that partitions the primary fluid chamber and the auxiliary fluid chamber, the oscillating plate is housed within the through-hole with a gap provided therebetween whereby the oscillating plate is displaceable in an axial direction within the through-hole. A stopper abutted by the oscillating plate during displacement to one axial side is provided, with the gap becoming closed off when the oscillating plate is in a state of abutment against the stopper.
Public/Granted literature
- US20090079118A1 Fluid filled type vibration damping device Public/Granted day:2009-03-26
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