Invention Grant
US08047855B2 High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
有权
高速，直通，阶梯式，具有改进的信号完整性特征的电子连接器及其制造方法
- Patent Title: High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture
- Patent Title (中): 高速，直通，阶梯式，具有改进的信号完整性特征的电子连接器及其制造方法
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Application No.: US12693097Application Date: 2010-01-25
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Publication No.: US08047855B2Publication Date: 2011-11-01
- Inventor: Gary Yasamura , Joseph C. Fjelstad , William F. Wiedemann , Para K. Segaram , Kevin P. Grundy
- Applicant: Gary Yasamura , Joseph C. Fjelstad , William F. Wiedemann , Para K. Segaram , Kevin P. Grundy
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00
Abstract:
An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
Public/Granted literature
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