Printed wiring boards for communications connectors are provided that include a mounting substrate having at least first through third input terminals and first through third output terminals. A first conductive path connects the first input terminal to the first output terminal, a second conductive path connects the second input terminal to the second output terminal and a third conductive path connects the third input terminal to the third output terminal. A first inductor and a first capacitor are coupled between the first conductive path and the second conductive path, where the first inductor and the first capacitor are arranged in series to provide a first series inductor-capacitor circuit. A second capacitor is coupled between the third conductive path and the second conductive path through the first inductor to provide a second series inductor-capacitor circuit that shares the inductor of the first series inductor-capacitor circuit. Communications connectors that include such wiring boards or equivalent structures are also provided.