Invention Grant
- Patent Title: Magnet unit and magnetron sputtering apparatus
- Patent Title (中): 磁体单元和磁控溅射装置
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Application No.: US13058709Application Date: 2009-07-09
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Publication No.: US08048277B2Publication Date: 2011-11-01
- Inventor: Tetsuya Endo , Einstein Noel Abarra
- Applicant: Tetsuya Endo , Einstein Noel Abarra
- Applicant Address: JP Kawasaki-shi
- Assignee: Canon Anelva Corporation
- Current Assignee: Canon Anelva Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Fitzpatrick, Cella, Harper & Scinto
- Priority: JP2008-209964 20080818
- International Application: PCT/JP2009/003206 WO 20090709
- International Announcement: WO2010/021078 WO 20100225
- Main IPC: C23C14/35
- IPC: C23C14/35

Abstract:
A magnet unit, which can realize uniform film thickness distribution of a thin film formed on a substrate without increasing the length and width of a target. The magnet unit includes a peripheral magnet, which is disposed on the yoke on the back side of a cathode electrode so as to follow the outline of a target, and an inner magnet disposed in the peripheral magnet and having a polarity different from the polarity of the peripheral magnet. The magnet unit provides a magnetic track MT that is a set of regions which tangents of magnetic field lines M generated on the target parallels to the target surface. The magnet unit further includes n (n is a positive integer of two or more) extending magnetic pole portions and n−1 projecting magnetic pole portions, which form 2n−1 folded shape portions U at the both ends in the longitudinal direction of the magnetic track.
Public/Granted literature
- US20110180401A1 MAGNET UNIT AND MAGNETRON SPUTTERING APPARATUS Public/Granted day:2011-07-28
Information query
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