Invention Grant
- Patent Title: Etching composition and etching process
- Patent Title (中): 蚀刻成分和蚀刻工艺
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Application No.: US12943639Application Date: 2010-11-10
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Publication No.: US08048331B2Publication Date: 2011-11-01
- Inventor: Masahide Matsubara , Taketo Maruyama
- Applicant: Masahide Matsubara , Taketo Maruyama
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee: Mitsubishi Gas Chemical Company, Inc.
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2006-145440 20060525
- Main IPC: B44C1/22
- IPC: B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00 ; C25F3/00
Abstract:
An etching composition which comprises at least one organic carboxylic acid compound selected from acetic acid, propionic acid, butyric acid, succinic acid, citric acid, lactic acid, malic acid, tartaric acid, malonic acid, maleic acid, glutaric acid, aconitic acid, 1,2,3-propanetricarboxylic acid and ammonium salts of these acids, a polysulfonic acid compound and water, and an etching process which comprises etching a conductive film comprising zinc oxide as the main component using the etching composition described above.
Public/Granted literature
- US20110049088A1 ETCHING COMPOSITION AND ETCHING PROCESS Public/Granted day:2011-03-03
Information query
