Invention Grant
- Patent Title: Resin infusion potting
- Patent Title (中): 树脂灌注灌封
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Application No.: US12378505Application Date: 2009-02-17
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Publication No.: US08048357B2Publication Date: 2011-11-01
- Inventor: Kevin J. Barefield , Richard Campbell
- Applicant: Kevin J. Barefield , Richard Campbell
- Agent J. Wiley Horton
- Main IPC: B29C45/14
- IPC: B29C45/14

Abstract:
A process for forcibly infusing liquid potting compound into the exposed strands of a cable prior to forming a termination. The process uses a mold that encloses the exposed strands. Potting compound is then pumped into the mold, where it runs around and through the exposed strands. A second venting passage is preferably employed, so that the liquid potting compound flows through the mold without trapping any air pockets.
Public/Granted literature
- US20090189308A1 Resin infusion potting Public/Granted day:2009-07-30
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