Invention Grant
- Patent Title: Method of fabricating superconducting wire and superconducting apparatus
- Patent Title (中): 制造超导线及超导装置的方法
-
Application No.: US12063941Application Date: 2006-08-30
-
Publication No.: US08048475B2Publication Date: 2011-11-01
- Inventor: Munetsugu Ueyama , Kazuya Ohmatsu
- Applicant: Munetsugu Ueyama , Kazuya Ohmatsu
- Applicant Address: JP Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka
- Agency: Foley & Lardner LLP
- Priority: JP2005-270225 20050916
- International Application: PCT/JP2006/317077 WO 20060830
- International Announcement: WO2007/032207 WO 20070322
- Main IPC: B05D5/12
- IPC: B05D5/12

Abstract:
An object of the present invention is to provide a method of fabricating a superconducting wire that can reduce the fabrication cost and increase the mechanical strength of the superconducting wire, and a superconducting apparatus including a superconducting wire obtained by the method. The present invention provides a method of fabricating a superconducting wire including the steps of forming a superconducting layer on a substrate or an intermediate layer formed on the substrate, forming a silver stabilization layer on the superconducting layer, immersing the substrate in a copper sulfate solution after the superconducting layer and the silver stabilization layer are formed thereon, and forming a copper stabilization layer on the silver stabilization layer by electroplating with the copper sulfate solution as a plating bath. A superconducting apparatus including a superconducting wire obtained by the method is also provided.
Public/Granted literature
- US20090137399A1 METHOD OF FABRICATING SUPERCONDUCTING WIRE AND SUPERCONDUCTING APPARATUS Public/Granted day:2009-05-28
Information query