Invention Grant
- Patent Title: Multilayer heat sealant structures, packages and methods of making the same
- Patent Title (中): 多层热封结构，封装及其制作方法
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Application No.: US11871459Application Date: 2007-10-12
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Publication No.: US08048521B2Publication Date: 2011-11-01
- Inventor: Suzanne E. Schaefer , Robert J. Blemberg , Roger P. Genske
- Applicant: Suzanne E. Schaefer , Robert J. Blemberg , Roger P. Genske
- Applicant Address: US WI Oshkosh
- Assignee: Bemis Company, Inc.
- Current Assignee: Bemis Company, Inc.
- Current Assignee Address: US WI Oshkosh
- Agency: Banner & Witcoff, Ltd.
- Main IPC: B32B7/12
- IPC: B32B7/12 ; B32B15/04
Abstract:
The embodiments of the present invention relate to multilayer thermoplastic structures having improved sealability and tearability. More specifically, the present invention relates to a multilayer heat sealant structure having at least three layers that may be coextrusion coated or otherwise laminated to a substrate, such as metallized polymeric material, foil, or other substrates.
Public/Granted literature
- US20080057239A1 Multilayer Heat Sealant Structures, Packages And Methods Of Making The Same Public/Granted day:2008-03-06
Information query
