Invention Grant
- Patent Title: Wire loop and method of forming the wire loop
- Patent Title (中): 线环和形成线环的方法
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Application No.: US12375238Application Date: 2008-01-30
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Publication No.: US08048720B2Publication Date: 2011-11-01
- Inventor: Dodgie Reigh M. Calpito , O Dal Kwon
- Applicant: Dodgie Reigh M. Calpito , O Dal Kwon
- Applicant Address: US PA Fort Washington
- Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee: Kulicke and Soffa Industries, Inc.
- Current Assignee Address: US PA Fort Washington
- Agent Christopher M. Spietzer, Sr.
- International Application: PCT/US2008/052378 WO 20080130
- International Announcement: WO2009/096950 WO 20090806
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/82
Abstract:
A method of forming a wire loop is provided. The method includes: (1) forming a first fold of wire; (2) bonding the first fold of wire to a first bonding location to form a first bond; (3) extending a length of wire, continuous with the first bond, between (a) the first bond and (b) a second bonding location; and (4) bonding a portion of the wire to the second bonding location to form a second bond.
Public/Granted literature
- US20100230809A1 WIRE LOOP AND METHOD OF FORMING THE WIRE LOOP Public/Granted day:2010-09-16
Information query
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