A method of forming a pattern and a method of producing an electronic element are characterized by including a first step of forming an electrically conductive film (D) by applying a liquid composition onto a first plate (10), and heating the first plate (10); a second step of forming an electrically conductive pattern (D′) on the first plate (10) by pressing a second plate (20) having a projection-and-recess pattern on a surface side thereof onto a surface side of the first plate (10), on which the electrically conductive film (D) is formed, to transfer an unwanted pattern of the electrically conductive film (D) to top faces of projections (20a) of the second plate (20), thereby removing the unwanted pattern; and a third step of transferring the electrically conductive pattern (D′) to a surface of a transfer-receiving substrate (30) by pressing the surface side of the first plate (10), on which the electrically conductive pattern (D′) is formed, onto the surface of the transfer-receiving substrate (30), wherein the liquid composition contains a solvent having a vapor pressure of 133 Pa or less at a surface temperature of the heated first plate (10). These methods provide a method of forming a pattern and a method of producing an electronic element in which a state of a liquid-composition coating film is stabilized and a fine and precise pattern can be stably formed with good reproducibility.