Invention Grant
- Patent Title: Method for manufacturing semiconductor device, semiconductor device and electronic appliance
- Patent Title (中): 半导体器件,半导体器件和电子器件的制造方法
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Application No.: US12275840Application Date: 2008-11-21
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Publication No.: US08048771B2Publication Date: 2011-11-01
- Inventor: Tomokazu Yokoi , Yujiro Sakurada
- Applicant: Tomokazu Yokoi , Yujiro Sakurada
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Fish & Richardson P.C.
- Priority: JP2007-305289 20071127
- Main IPC: H01L21/46
- IPC: H01L21/46

Abstract:
A non-single-crystal semiconductor layer is formed over a substrate, and then a single crystal semiconductor layer is formed over part of the non-single-crystal semiconductor layer. Thus, a semiconductor element of a region which requires a large area (e.g. a pixel region in a display device) can be formed using the non-single-crystal semiconductor layer, and a semiconductor element of a region which requires high speed operation (e.g. a driver circuit region in a display device) can be formed using the single crystal semiconductor layer.
Public/Granted literature
- US20090134397A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ELECTRONIC APPLIANCE Public/Granted day:2009-05-28
Information query
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