Invention Grant
- Patent Title: Methods of manufacturing semiconductor devices including a doped silicon layer
- Patent Title (中): 制造包括掺杂硅层的半导体器件的方法
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Application No.: US12284565Application Date: 2008-09-23
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Publication No.: US08048784B2Publication Date: 2011-11-01
- Inventor: Pil-Kyu Kang , Yong-Hoon Son , Jong-Wook Lee
- Applicant: Pil-Kyu Kang , Yong-Hoon Son , Jong-Wook Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec
- Priority: KR10-2007-0104314 20071017
- Main IPC: H01L21/36
- IPC: H01L21/36

Abstract:
Methods for manufacturing a semiconductor device include forming a seed layer containing a silicon material on a substrate. An amorphous silicon layer containing amorphous silicon material is formed on the seed layer. The amorphous silicon layer is doped with an impurity. A laser beam is irradiated onto the amorphous silicon layer to produce a phase change of the amorphous silicon layer and change the amorphous silicon layer into a single-crystal silicon layer based on the seed layer.
Public/Granted literature
- US20090104759A1 Methods of manufacturing semiconductor devices including a doped silicon layer Public/Granted day:2009-04-23
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