Invention Grant
US08048793B2 Flip chip for electrical function test and manufacturing method thereof
有权
倒装芯片用于电气功能测试及其制造方法
- Patent Title: Flip chip for electrical function test and manufacturing method thereof
- Patent Title (中): 倒装芯片用于电气功能测试及其制造方法
-
Application No.: US12203280Application Date: 2008-09-03
-
Publication No.: US08048793B2Publication Date: 2011-11-01
- Inventor: Seung Boo Jung , Jong Woong Kim
- Applicant: Seung Boo Jung , Jong Woong Kim
- Applicant Address: KR Suwon, Gyeonggi-Do
- Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee: Sungkyunkwan University Foundation for Corporate Collaboration
- Current Assignee Address: KR Suwon, Gyeonggi-Do
- Agency: Edwards Angell Palmer & Dodge LLP
- Agent Kongsik Kim
- Priority: KR10-2007-0089905 20070905
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01L21/498
Abstract:
Disclosed is a method for manufacturing a flip chip, in which a gold typically used in a flip chip manufacturing is adhered by conductive adhesives, wherein the method comprises steps of depositing a metal seed layer on a substrate; applying and patterning a photoresist or a dry film; forming a gold bump by electroplating; patterning the seed layer; forming an insulating layer on the seed layer and upper end of the gold bump; and patterning an insulating layer. Accordingly, it is possible to manufacture a flip chip, in which electrical function between bumps can be evaluated, with less cost.
Public/Granted literature
- US20090057921A1 FLIP CHIP FOR ELECTRICAL FUNCTION TEST AND MANUFACTURING METHOD THEREOF Public/Granted day:2009-03-05
Information query
IPC分类:
