Invention Grant
- Patent Title: Substrate with feedthrough and method for producing the same
- Patent Title (中): 具有馈通的基板及其制造方法
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Application No.: US11751396Application Date: 2007-05-21
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Publication No.: US08048801B2Publication Date: 2011-11-01
- Inventor: Stephan Dertinger , Alfred Martin , Barbara Hasler , Grit Sommer , Florian Binder
- Applicant: Stephan Dertinger , Alfred Martin , Barbara Hasler , Grit Sommer , Florian Binder
- Applicant Address: DE Neubiberg DE Munich
- Assignee: Infineon Technologies, AG,Qimonda AG
- Current Assignee: Infineon Technologies, AG,Qimonda AG
- Current Assignee Address: DE Neubiberg DE Munich
- Agency: Edell, Shapiro & Finnan, LLC
- Priority: DE102007019552 20070425
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A substrate with first and second main surfaces includes at least one channel extending from the first main surface to the second main surface. The at least one channel includes a first cross-sectional area at a first location and a second cross-sectional area at a second location. An electrically conductive first material is disposed in the at least one channel.
Public/Granted literature
- US20080268638A1 Substrate with Feedthrough and Method for Producing the Same Public/Granted day:2008-10-30
Information query
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