Invention Grant
- Patent Title: Polyamide resin composition
- Patent Title (中): 聚酰胺树脂组合物
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Application No.: US12602701Application Date: 2008-06-04
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Publication No.: US08048944B2Publication Date: 2011-11-01
- Inventor: Norio Sakata
- Applicant: Norio Sakata
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, PLC
- Priority: JP2007-149532 20070605
- International Application: PCT/JP2008/060276 WO 20080604
- International Announcement: WO2008/149892 WO 20081211
- Main IPC: C08K5/3492
- IPC: C08K5/3492 ; C08K5/103

Abstract:
The present invention provides a polyamide resin composition comprising a polyamide resin (A), a melamine cyanurate-based flame retardant (B) and a surfactant (C), wherein the polyamide resin composition comprises 100 parts by mass of the total of 60 to 75% by mass of the polyamide resin (A) comprising at least one or more polyamide resin (A1) having a melting point of 255 to 270° C. and 25 to 40% by mass of the melamine cyanurate-based flame retardant (B), and 0.1 to 1.0 part by mass of the surfactant (C) comprising at least one or more fatty acid ester of a polyalkylene polyhydric alcohol, and wherein the melamine cyanurate-based flame retardant (B) dispersed in the polyamide resin composition has an average dispersion particle diameter of 1 to 20 μm.
Public/Granted literature
- US20100179258A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2010-07-15
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