Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12485091Application Date: 2009-06-16
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Publication No.: US08049111B2Publication Date: 2011-11-01
- Inventor: Katsutoshi Kamei , Voonyee Ho
- Applicant: Katsutoshi Kamei , Voonyee Ho
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2008-161599 20080620
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
A first insulating layer is formed on a suspension body. Wiring traces are formed in parallel at an interval on the first insulating layer. A second insulating layer is formed in a region on the first insulating layer on both sides of the wiring traces. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A wiring trace is formed in a region on the second insulating layer on the side of the wiring trace. A third insulating layer is formed on the first and second insulating layers to cover the wiring traces.
Public/Granted literature
- US20090316300A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2009-12-24
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