Invention Grant
- Patent Title: Flexible circuit with cover layer
- Patent Title (中): 柔性电路与覆盖层
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Application No.: US11735167Application Date: 2007-04-13
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Publication No.: US08049112B2Publication Date: 2011-11-01
- Inventor: Rui Yang
- Applicant: Rui Yang
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Melanie G. Gover
- Main IPC: H05K1/00
- IPC: H05K1/00
Abstract:
The invention relates to flexible circuits and more particularly to flexible printed circuits having cover layers. The cover layers may be a chemically-etchable adhesive polyimide. The cover layers may be patterned after they are applied to the flexible circuit substrate.
Public/Granted literature
- US20080254392A1 FLEXIBLE CIRCUIT WITH COVER LAYER Public/Granted day:2008-10-16
Information query
