Invention Grant
- Patent Title: Printed circuit boards
- Patent Title (中): 印刷电路板
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Application No.: US12047152Application Date: 2008-03-12
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Publication No.: US08049113B2Publication Date: 2011-11-01
- Inventor: Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
- Applicant: Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
- Applicant Address: CN Shenzhen TW Tayuan, Taoyuan
- Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee: FuKui Precision Component (Shenzhen) Co., Ltd.,Zhen Ding Technology Co., Ltd.
- Current Assignee Address: CN Shenzhen TW Tayuan, Taoyuan
- Agency: Altis Law Group, Inc.
- Priority: CN200710074364 20070518
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
Public/Granted literature
- US20080283289A1 PRINTED CIRCUIT BOARDS Public/Granted day:2008-11-20
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