Invention Grant
- Patent Title: Laser processing machine
- Patent Title (中): 激光加工机
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Application No.: US12110916Application Date: 2008-04-28
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Publication No.: US08049134B2Publication Date: 2011-11-01
- Inventor: Keiji Nomaru , Hitoshi Hoshino , Koji Yamaguchi
- Applicant: Keiji Nomaru , Hitoshi Hoshino , Koji Yamaguchi
- Applicant Address: JP Tokyo
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Current Assignee Address: JP Tokyo
- Agency: Greer, Burns & Crain, Ltd.
- Priority: JP2007-135783 20070522
- Main IPC: B23K26/067
- IPC: B23K26/067 ; H01L21/301

Abstract:
A laser processing machine having a laser beam irradiation unit is provided. The laser beam irradiation unit includes: a laser beam oscillation section; a beam splitter adapted to split the laser beam emitted from the laser beam oscillation section into a first laser beam and a second laser beam; a condenser lens adapted to condense the first and second laser beams; a prism adapted to lead the first and second laser beams split by the beam splitter to the condenser lens; a first angle-changing mirror disposed on a first optical path adapted to lead the first laser beam split by the beam splitter; a second angle-changing mirror disposed on a second optical path adapted to lead the second laser beam split by the beam splitter to the prism; and a half-wave plate disposed in the first or second optical path to allow one of respective directions of the first and second polarization planes to be aligned with the other.
Public/Granted literature
- US20080290078A1 LASER PROCESSING MACHINE Public/Granted day:2008-11-27
Information query
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