Invention Grant
- Patent Title: Optoelectronic component with flip-chip mounted optoelectronic device
- Patent Title (中): 具有倒装芯片的光电器件的光电元件
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Application No.: US12837734Application Date: 2010-07-16
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Publication No.: US08049161B2Publication Date: 2011-11-01
- Inventor: David W. Sherrer , Noel A. Heiks
- Applicant: David W. Sherrer , Noel A. Heiks
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01J40/14
- IPC: H01J40/14
Abstract:
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Public/Granted literature
- US20110062455A1 OPTOELECTRONIC COMPONENT Public/Granted day:2011-03-17
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